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Diamond Wire
General description
Noritake proposes the diamond wire for the silicon ingot slicing process to replace the conventional slurry wire. Noritake's diamond wire materializes substantial reduction of environmental burden with its slurry free process and significantly improves the efficiency of the slicing process.
Two types of product, a resin bonded type and an electroplated type, are available.
Feature
  1. High slicing efficiency; diamond wire vs. conventional slurry wire process.
  2. High stability of slicing precision; less deteriorated layer, higher yield ratio.
  3. Possible to use water-soluble fluid; better working environment, less workload in the process after slicing such as washing process.
  4. Possible to reduce the consumption of wire and slurry; easy to collect the sludge, increase the possibility of reclamation of silicon.
Specifications
  Diameter of wire Designation of grit size
Resin bonded type φ 150~200μm φ 15~40μm
Electroplated type φ150~350μm φ 10~30μm
We correspond to the requests such as thin wire and thick wire.
Select resin bond for better quality, electro-plated for high efficiency.

Resin bonded type
Electroplated type
Product guide / Vitrified grinding wheel / Resinoid grinding wheel / Grinding tool / Vitrified CBN and diamond wheel /
Metal CBN and diamondwheel / Resinoid CBN and diamond wheel / Electroplated CBN and diamond wheel / Cutting tool /
Dresser / Diamond cutter/ Abrasive cloth and paper / Coolant / Grinding machine /
Peripheral equipment / Filtration equipment / Related products / Standard items/ Diamond Wire/ Diamond Band