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Diamond Band
General description
Diamond band is used for cutting process such as cropping, blocking and squaring.
Two types of product, metal bonded type for polycrystalline silicon and electroplated type for monocrystalline silicon are available.

Metal Bonded Diamond Band
Feature
  1. High-level stable cutting ability by Noritake diamond grain distribution technology.
  2. Good edge shape sustainability and long life.

Straightness keeping and long life are achieved

Electroplated Diamond Band
Feature
  1. Thin core can be attained by raising the intensity of a substrate,
  2. The straightness stabilized of cut by giving special tension processing to substrate is obtained.
  3. Various E.P pattern is available for high efficiency and high accuracy cut.
Specifications
Designation of grit size Length Core width Core thickness Diamond layer thickness
Metal bonded type #40~200 4,100~9,800mm 50~160mm 0.5~2.0mm 0.9~2.5mm
Electroplated type #40~200 1,500~9,000mm 10~ 60mm 0.3~1.0mm 0.5~2.0mm
Product guide / Vitrified grinding wheel / Resinoid grinding wheel / Grinding tool / Vitrified CBN and diamond wheel /
Metal CBN and diamondwheel / Resinoid CBN and diamond wheel / Electroplated CBN and diamond wheel / Cutting tool /
Dresser / Diamond cutter/ Abrasive cloth and paper / Coolant / Grinding machine /
Peripheral equipment / Filtration equipment / Related products / Standard items/ Diamond Wire/ Diamond Band