Fixed Abrasive Polishing Tools LHA Pad

As an initiative to reduce CO2 emissions accelerates, hybrid cars and fuel-cell vehicles are attracting much attention. Motor controllers on these motor-driven cars comprise components called power semiconductors. Power semiconductors currently adopt single crystal silicon substrates and it is said that single-crystal SiC (silicon carbide) is the way forward, as it is efficient with a low heat release value and enables downsizing of final products. For making a device, the surface of single-crystal SiC requires mirror-like finishing but because single-crystal SiC is a very hard material, it takes a considerable amount of time to polish using the widely-applied loose abrasive polishing process, thus incurring high costs.
Hence, Noritake has been engaged in the development of fixed abrasive polishing tools by employing the LHA pad. By employing the LHA (Loosely Held Abrasive) structure that incorporates abrasives in a special type of resin, the advantages of loose abrasive polishing (high removal rate and low scratching rate) are combined with the advantage of fixed abrasive polishing (smooth polishing) to create a perfect balance of the LHA pad. In addition, because the LHA pad does not comprise slurry, it enables great waste reduction.

Polishing Performance in Comparison