Response to upsizing wafer
· Reduction of chipping at loading operation (No touch with process pipe by vertical holding boat (vibration reduction)

Response to thinner wafer
· Reduction of warpage and slip by heat treatment (Horizontal stacking by vertical boat)

Response to automation
· Work saving by automatically conveyance
· Ease of full-automation by horizontal conveyance

Response to saving energy
· Reduction of heat loss from furnace duct, improvement of heat insulation (High heat insulation by sealed structure at heater upper part(improve uniform heat length rate))

Response to high-purified
· Reduction of particle occurrence by loading operation (No touch with process pipe by vertical holding boat)
·Aeration into process pipe
（Less aeration at opening furnace duct (depressed of natural oxidized membrane
generation) )

Response to price-reduction

Commoditizing/integration of high-cost equipment
·Commoditizing of wafer transfer and conveyance equipment (three-tube commoditized)
· Cost reduction by tree-tube commoditized

Adequate clean, response to high-purified
·Review specification of constructional material and purchased equipment.

Simplification of control method (temperature, gas, conveyance)
·Introduction of the present horizontal diffusion furnace

Simplification of specification limited production process.
·Furnace pressure controller and inside temperature measuremment are option