Diamond Band Saw
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Diamond saw is used for cutting process such as cropping, blocking and squaring.
Two types of product, metal bonded type for polycrystalline silicon and electroplated type for monocrystalline silicon, sapphire are available.
Metal Bond Band Saw
Features
1.The new bond (MS Series) and our original grain dispersion technology stabilizes the cutting performance.
2.Less dulling of the metal chip corners prevents inclined cutting.
3.Special stainless steel with high fatigue strength for the substrate enables a long life.
Applications
Cutting of silicon, glass, magnetic materials, carbon, etc.
Electroplated Band Saw
Feature
1. Special substrate enables high precision cutting.
2. High ef ciency and long life can be attained by selecting the electroplating type(pattern, continuous).
Applications
Cutting of silicon, sapphire, glass, magnetic materials, carbon, etc.
Specifications
| Type | Designation of grit size | Length | width | Substarate thickness | Diamond layer thickness |
|---|---|---|---|---|---|
| Metal bond | #60-120 | 3,660-10,000mm | 40-155mm | 0.5-1.25mm | 1.0-2.5mm |
| Electroplated | #40-200 | 1,500-9,000mm | 10-60mm | 0.3-0.7mm | 0.6-1.5mm |
