PRODUCTS
Diamond Band Saw
Grinding and Polishing Tools
-
Grinding Wheels
- Grinding Wheels List
- Ceramic Grain CX Wheel
- Vitrified-bonded Wheel for Gear Grinding "Gear Ace"
- New Super-finishing Wheel "Keen Stone"
- Vitrified-Bonded Wheel for Precision Grinding "LIFE KING"
- New Mirror Grinding Super-finishing Wheel "Mr. Neo Lapper"
- Billet and Slab Grinding 3Z Wheel
- High-Accuracy Resinoid Wheel "Flatdy"
- High-performance Resinoid Needle-grinding Wheel B88 Series
- High-performance Resinoid Roll Grinding Wheel
-
CBN Wheels
- CBN Wheels List
- Crank Shaft Grinding CBN Wheel "Σ Wheel"
- New Porous CBN "FP Wheel"
- Multi-pore General-use CBN Wheel "KP-MEMOX"
- High-precision Flat Lapping CBN Wheel
- Super Long Life Vit-CBN Wheel "MEGA-LIFE WHEEL"
- Mirror-finish CBN Wheel
- Vitrified-bond CBN "Muscle Wheel"
- Centerless Vitrified-bond CBN/Diamond Wheel "Seamless Centerless Wheel"
- Internal Grinding CBN Wheel "XAP Wheel"
-
Diamond Tools
- Diamond Tools List
- Beveling Wheel for Wafer
- Metal Wheel for Super-Hard Main Groove Grinding "Dress-less Metal (MDL)"
- Fixed Diamond Lapping Manufacture Metal Wheel
- Grain Single-layered Metal Bonded CBN Wheel "CBN Grit Ace"
- Honing Wheel Applicable to Water Soluble Coolant
- Grinding Wheel for Super-Hard Drill and Endmill Grinding "i-Flute"
- Cutting Tip Outer Edge Grinding Resin Wheel "i-Surface"
- Resin Bond Wheel for High Quality Profile Grinding "Keep Bright"
- Metal Bond Wheel for High Accuracy Profile Grinding "Keep Edge"
- General-use Multi-pore Diamond Grinding Wheel "SD MEMOX"
- Poreless Vitrified Diamond PCD Grinding Wheel "Smooth Fine"
- Surface Grinding Wheel for Solar Cell Silicon Ingots
- Porous Vitrified-bonded Diamond Wheel "VDH Wheel"
- Vitrified-bond Wheel for Cutting Tip Outer Edge Grinding "VTS Wheel"
- Mirror Finish Resinoid Wheel "Shine-G"
- Diamond Band Saw
- Diamond Wire(Rejin bond,Electroplated)
- ID Blade
- OD Blade
- Forming Dresser
- Grit Dresser
- LL Dressers
- Rotary Dresser
- Coated Abrasive
- Coolants
- Related Products
- NORITAKE TECHNICAL JOURNAL of Grinding & Polishing Technical Information
- Technical Support
- Catalog Download
- List of Catalog Download
- Grinding & Polishing Technical Information "NORITAKE TECHNICAL JOURNAL"
- About Our Sales Offices
Technical Support
-
Diamond saw is used for cutting process such as cropping, blocking and squaring. Two types of product, metal bonded type for polycrystalline silicon and electroplated type for monocrystalline silicon, sapphire are available.
Metal Bond Band Saw
- Features
- 1.The new bond (MS Series) and our original grain dispersion technology stabilizes the cutting performance.
2.Less dulling of the metal chip corners prevents inclined cutting.
3.Special stainless steel with high fatigue strength for the substrate enables a long life.
Electroplated Band Saw
- Feature
- 1. Special substrate enables high precision cutting.
2. High ef ciency and long life can be attained by selecting the electroplating type(pattern, continuous).
Applications
Cutting of silicon, glass, magnetic materials, carbon, etc.
Specifications
| Type | of grit size | Length | width |
Substarate thickness |
Diamond layer thickness |
|---|---|---|---|---|---|
| Metal bond | #60-120 | 3,660-10,000mm | 40-155mm | 0.5-1.25mm | 1.0-2.5mm |
| Electroplated | #40-200 | 1,500-9,000mm | 10-60mm | 0.3-0.7mm | 0.6-1.5mm |
Applications
Cutting of silicon, sapphire, glass, magnetic materials, carbon, etc.
