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Beveling Wheel for Wafer
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Grinding Wheels
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- Ceramic Grain CX Wheel
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CBN Wheels
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- Crank Shaft Grinding CBN Wheel "Σ Wheel"
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- Beveling Wheel for Wafer
- Metal Wheel for Super-Hard Main Groove Grinding "Dress-less Metal (MDL)"
- Fixed Diamond Lapping Manufacture Metal Wheel
- Grain Single-layered Metal Bonded CBN Wheel "CBN Grit Ace"
- Honing Wheel Applicable to Water Soluble Coolant
- Grinding Wheel for Super-Hard Drill and Endmill Grinding "i-Flute"
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- Metal Bond Wheel for High Accuracy Profile Grinding "Keep Edge"
- General-use Multi-pore Diamond Grinding Wheel "SD MEMOX"
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- Surface Grinding Wheel for Solar Cell Silicon Ingots
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Technical Support
Beveling Wheel and Notched Wheel for Silicon and Sapphire Wafers
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Grinding wheel for bevel machining of semiconductor material substrates.
Thanks to a design featuring a uniform layer of fine grains and high-precision finishing technology, this grinding wheel makes high-quality, high-precision machining possible with minimal chipping.Both outer-circumference machining and notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.
Features
- Even and ne diamond layer minimizes processing damage.
- Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life.
- Highly precise slotted shape and nishing technology support various wafer shapes.
- Copper-less supported.
Standard Selection
| Applications | Sapphire machining | Silicon machining | ||
|---|---|---|---|---|
| Emphasis on cutting | Standard | Emphasis on durability | ||
| Bond type | L-MSF | N-MB00 | P-MB01 | R-MB02 |
Case Study
| Beveling silicon wafers | Beveling sapphire wafers | ||
|---|---|---|---|
| Outer circumference machining |
Wheel size | φ202×20T×19U×30H×3.7X | φ202×20T×19U×30H×3.7X |
| Wheel specifications | SD800/1500 P - MB01 | SD400 L - MSF | |
| Notch machining | Wheel size | φ3.8×36L×11T×8U×1.4X | φ3.8×36L×11T×8U×1.4X |
| Wheel specifications | SD800/1500 P - MB01 | SD400 L - MSF>SD400 L - MSF | |
