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Thick Film Circuit Substrate
- Thick Film Circuit Substrate with Precious Metal design guidance
- About Our Technology
- New Copper Conductors + Plating Substrate design guidance
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Porous ceramic component
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About Our Thick Film Manufacturing Technology
Gold-plated Printed Substrates
Printed circuit substrates with silver conductor traces can be plated with gold.
This results in excellent soldering and wire bonding characteristics.
Long-length Substrates
Thick film circuits can be formed on ceramic substrates up to 310 mm in length.
Substrate size: 310 mm × 95 mm maximum
Fine Line Printing
Minimum lines and spacing: 50 μm / 50 μm
Castellation
Circuit substrates can be castellated to support surface mount devices.
Via-filling Substrates
Via-filling substrates can handle higher current levels than ordinary through-hole substrates.
They are also effective in raising heat dissipation with thermal vias.
