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Product Lineup by Material
Ceramics & Materials
- Electronic Paste (Thick Film)
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Engineering Ceramics
- Engineering Ceramics List
- Ceramic cores for precision casting
- Porous ceramic component
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- Gypsum
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- Technical Support List
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- Thick Film Circuit Substrate with Precious Metal design guidance
- About Our Technology
- New Copper Conductors + Plating Substrate design guidance
- Thick Film Circuit Substrate with Copper Conductors design guidance
- Thick Film Heater design guidance
- Catalog Lineup
- Pore size control for porous ceramic components
- Core Material Characteristics
- ℃ MONARC Characteristics
- Catalog Download
- About Our Sales Offices
Pt Paste
| Product Name (Series) |
Firing Temperature |
Film Formation Method |
Application | Remarks | Lead-Free OK |
|---|---|---|---|---|---|
| NP-1300 | 900-1200°C | Screen printing | Sensors, piezoelectric ceramics, varistors, condensers and other electrodes | Good coverage, thin layering possible, good adhesion to ceramic substrates | ● |
| NP-1610 | 1200-1400°C | High heat resistance and reliability | ● |
Ag/Pd Paste
| Product Name (Series) |
Firing Temperature |
Film Formation Method |
Application | Ag/Pd Powder | Remarks | Lead-Free OK |
|---|---|---|---|---|---|---|
| NP-3200 | 850-1050°C | Screen printing | Piezoelectric ceramics, varistors, LTCC, resonators and other internal electrodes | Coprecipitated | Low-cost type, thin layering possible, Ag/Pd = 90/10 – 70/30 | ● |
| NP-3000 | 900-1150°C | Alloy | Highly heat-resistant type, good coverage, Ag/Pd = 90/10 – 70/30 | ● |
Ag Paste
| Product Name (Series) |
Firing Temperature |
Film Formation Method |
Application | Remarks | Lead-Free OK |
|---|---|---|---|---|---|
| NP-4635 | 450-550°C | Screen printing | Glass and ceramic substrate electrodes | Low firing temperatures, low resistance, good adhesiveness | ● |
| NP-4300 | 800-850°C | Ceramic substrates, chip resistors, external electrodes for LTCC | Compatible without coat, good solderability | ● | |
| NP-4100 | 850-900°C | Internal electrodes for LTCC and inductors | Low resistance, shrinkage curvature control, high-definition patterns | ● | |
| NP-4200 | Non-shrinkable type, fills well | ● | |||
| NP-4424 | 680-720°C | Dip | Inductors, varistors, chip resistors, external electrodes for LTCC | Applies smoothly, good adhesiveness | ● |
| NP-4324 | 800-850°C | Compatible without coat, good solderability | ● | ||
| NP-4389 | 800-850°C | Decalcomania roll | Compatible without coat, optimal for multiple terminals | ● | |
| NP-4700 | 550-600°C | Photo process | Glass substrate electrodes | Useable for high-definition patterns (L/S=30/30μm) |
● |
Au Paste
| Product Name (Series) |
Firing Temperature |
Film Formation Method |
Application | Remarks | Lead-Free OK |
|---|---|---|---|---|---|
| NP-5100 | 850-900°C | Screen printing | Electrodes for glass and ceramic substrates as well as chip parts | Good adhesiveness, good for elaborate detail | ● |
Glass Paste
| Product Name (Series) |
Firing Temperature |
Film Formation Method |
Application | Remarks | Lead-Free OK |
|---|---|---|---|---|---|
| NP-7091 | 450-550°C | Screen printing | Glass substrates | Low firing temperatures, good acid resistance | ● |
| NP-7770 | 550-600°C | Transparent type, high transmittance | ● | ||
| NP-7612 | 800-900°C | Special quality: high voltage resistance | ● |
Au Resinate Paste
| Product Name (Series) |
Firing Temperature |
Film Formation Method |
Application | Remarks | Lead-Free OK |
|---|---|---|---|---|---|
| D-25 | 750-850°C | Screen printing | Electrodes for image sensors thermal printers heads and so on | Thin film at 0.2 - 0.6 μm when fired, capable of wire bonding | ● |
*Lead-Free OK: Shown on paste with no lead oxide or less than 1,000 ppm.
Please note that specification changes and product removal may occur without prior notice.
We can recommend various pastes according to your needs in addition to the product numbers above.
