PRODUCTS
Paste for Electronic Components
Ceramics & Materials
- Electronic Paste (Thick Film)
-
Engineering Ceramics
- Engineering Ceramics List
- Ceramic cores for precision casting
- Porous ceramic component
- Thick Film Circuit Substrate
- Gypsum
- Decoration Materials
- Electronic Ceramic Powder
- Vacuum Fluorescent Display
- Dental Materials
- Technical Support
- Technical Support List
- What is decalcomania?
- Thick Film Circuit Substrate with Precious Metal design guidance
- About Our Technology
- New Copper Conductors + Plating Substrate design guidance
- Thick Film Circuit Substrate with Copper Conductors design guidance
- Thick Film Heater design guidance
- Catalog Lineup
- Pore size control for porous ceramic components
- Core Material Characteristics
- ℃ MONARC Characteristics
- Catalog Download
- About Our Sales Offices
Product Lineup
Paste for LTCC (Low Temperature Co-fired Ceramics)
Features
- Lead-free
- Compatible without coat
- Good matching with body by controlling shrinkage curve
- Good solderability
- Fills well
Internal Electrode Paste -- NP-4100 Series
Via Electrode Paste -- NP-4200 Series (Non-shrink type)
External Electrode Paste -- NP-4300 Series
| Filler | Firing Temperature | Film Formation Method |
|---|---|---|
| Ag | 800-900°C | Screen printing |
Paste for Chip Inductors
Features
- Lead-free
- Low resistance, useable for high-definition patterns
- Good adhesiveness
- Good solderability
- Fills well
Internal Electrode Paste -- NP-4100 Series
Via Electrode Paste -- NP-4892 Series
External Electrode Paste -- NP-4424 Series, NP-4324 Series
| Filler | Firing Temperature | Film Formation Method |
|---|---|---|
| Ag | 680-900°C | Screen printing / dipping |
Paste for Piezoelectric Ceramic
Features
- (Alloy, coprecipitated and mixed powders)
- (Ratios: 90/10, 85/15, 80/20, 70/30)
- Highly heat-resistant type (alloy) with good film coverage ratio
- Good adhesiveness
- Fills well
Internal Electrode Paste -- NP-3000 Series
External Electrode Paste -- NP-4017 Series
| Firing Temperature | Film Formation Method | |
|---|---|---|
| Internal electrode |
900-1150°C | Screen printing |
| External electrode |
550-600°C | Screen printing |
Paste for LEDs
Features
- Compatible without coat
- Good solder leach
- Good solderability
- High reflectivity
Wiring Electrode Paste -- NP-4378 Series
| Filler | Firing Temperature | Film Formation Method |
|---|---|---|
| Ag | 800-900°C | Screen printing |
Paste for Varistors
Features
- Highly heat-resistant type at 900 - 1500°C
- Applies well when dipped
- Good adhesiveness to ZnO substrates
Internal Electrode Paste -- NP-3000 Series
External Electrode Paste -- NP-4424 Series
| Firing Temperature | Film Formation Method | |
|---|---|---|
| Internal electrode |
900-1150°C | Screen printing / dipping |
| External electrode |
680-720°C | Dipping |
Paste for Resistors
Features
- Compatible without coat
- Good solderability
Back Surface Electrode Paste -- NP-4300A Series
Protective Glass Paste -- NP-7000 Series
Printing Glass Paste -- NP-7400 Series
| Firing Temperature | Film Formation Method | |
|---|---|---|
| Back Surface Ag | 800-850°C | Screen printing |
| Protective Glass | 600-700°C | Screen printing |
| Printing Glass | 580-620°C | Screen printing |
