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Paste for Electronic Components

Product Lineup

Paste for LTCC (Low Temperature Co-fired Ceramics)

Features
  • Lead-free
  • Compatible without coat
  • Good matching with body by controlling shrinkage curve
  • Good solderability
  • Fills well

Internal Electrode Paste -- NP-4100 Series
Via Electrode Paste -- NP-4200 Series (Non-shrink type)
External Electrode Paste -- NP-4300 Series

Filler Firing Temperature Film Formation Method
Ag 800-900°C Screen printing
LTCC用(低温焼成多層基板)ペースト

Paste for Chip Inductors

Features
  • Lead-free
  • Low resistance, useable for high-definition patterns
  • Good adhesiveness
  • Good solderability
  • Fills well

Internal Electrode Paste -- NP-4100 Series
Via Electrode Paste -- NP-4892 Series
External Electrode Paste -- NP-4424 Series, NP-4324 Series

Filler Firing Temperature Film Formation Method
Ag 680-900°C Screen printing / dipping
チップインダクター用ペースト

Paste for Piezoelectric Ceramic

Features
  • (Alloy, coprecipitated and mixed powders)
  • (Ratios: 90/10, 85/15, 80/20, 70/30)
  • Highly heat-resistant type (alloy) with good film coverage ratio
  • Good adhesiveness
  • Fills well

Internal Electrode Paste -- NP-3000 Series
External Electrode Paste -- NP-4017 Series

  Firing Temperature Film Formation Method
Internal
electrode
900-1150°C Screen printing
External
electrode
550-600°C Screen printing
圧電セラミック用ペースト

Paste for LEDs

Features
  • Compatible without coat
  • Good solder leach
  • Good solderability
  • High reflectivity

Wiring Electrode Paste -- NP-4378 Series

Filler Firing Temperature Film Formation Method
Ag 800-900°C Screen printing
LED用ペースト

Paste for Varistors

Features
  • Highly heat-resistant type at 900 - 1500°C
  • Applies well when dipped
  • Good adhesiveness to ZnO substrates

Internal Electrode Paste -- NP-3000 Series
External Electrode Paste -- NP-4424 Series

  Firing Temperature Film Formation Method
Internal
electrode
900-1150°C Screen printing / dipping
External
electrode
680-720°C Dipping
バリスタ用ペースト

Paste for Resistors

Features
  • Compatible without coat
  • Good solderability

Back Surface Electrode Paste -- NP-4300A Series
Protective Glass Paste -- NP-7000 Series
Printing Glass Paste -- NP-7400 Series

  Firing Temperature Film Formation Method
Back Surface Ag 800-850°C Screen printing
Protective Glass 600-700°C Screen printing
Printing Glass 580-620°C Screen printing
抵抗器用ペースト