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Diamond Wire(Rejin bond,Electroplated)

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05-01-diamond wire2s.jpgDiamond wire consists of a piano wire core with affixed diamond grains. Diamond tools are used to slice all kinds of materials, such as silicon and sapphire.
Using this diamond wire improves productivity compared to methods based on loose grain systems by improving machining efficiency and providing consistent machining precision. Since slurry isn’t required, diamond wire lets companies make significant reductions to their environmental impact.

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Rejin Bond

Resin bond diamond wire which enables a high precision, high grade slicing.

Electroplated

Electroplated diamond wire realizing high eficiency slicing.

 

Specifications 

TypeRejin BondElectroplated
Appearance
 レジンボンドタイプ写真  電着タイプ写真
Structure  wire_resin_st.jpg
 wire_ele_st.jpg
Product diameter Ø150~320μm Ø150~320μm
Core Wire diameter Ø120~250μm Ø120~250μm
Features
  • The fixed abrasive grain method enables high precision, high eficiency slicing.
  • The stable slicing precision reduces decomposed layers when slicing.
  • Hard materials can be sliced with a high eficiency.
Applications Slicing of silicon, magnetic materials, SiC, GaN, etc. Slicing of silicon, sapphires, magnetic materials, SiC, GaN, etc.

 

Processing examples

TypeRejin BondElectroplated
Work Polycrystalline Silicon   Sapphire 
Dimensions  □156mm 4inch 
 
Product diameter Ø150μm Ø250μm
Core Wire diameter Ø120μm Ø180μm
Grain diameter M12-25 M30-40
 
Wefar thickness 203μm  
Thickness variation   24μm
TTV 13μm 8.4μm
Waviness 26μm  
Warp   16~22μm
Surface roughness 0.3μm 0.27μm

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