NEWS

Development of Silver Paste for TGV Supporting the AI Era
- Toward Practical Use of Glass Substrates for Advanced Semiconductor 3D Packaging -

Noritake Diamond-Nickel Heat Dissipation Substrate Achieved a High Thermal Conductivity of 1200 W/(m･K)

Notice Concerning Company Split (Simplified Absorption-Type Company Split) With Subsidiary [PDF:125.46KB]

Successful Prototyping of a New Phosphorus-Free Glass Material Bondable to Aluminum at 300–350℃
– Utilizing Materials Informatics Based on 120 Years of Data –