NEWS

Development of a Conductive Adhesive for Automotive Electronics
- Contributing to the Advancement of Autonomous Driving Technologies -

Development of Silver Paste for TGV Supporting the AI Era
- Toward Practical Use of Glass Substrates for Advanced Semiconductor 3D Packaging -

Development of CO2 Sorbent for Industrial Waste Gas
- Enabling High-concentration CO2 Capture Under High-temperature Conditions, Jointly Developed with CSIR-NIIST in India -

Noritake Develops PFAS Removal System Using Fine Bubbles
- Achieves Over 99% Removal of High-Concentration PFAS -

Launch of Copper Nano Paste and Slurry for Semiconductor Circuit Formation
- Copper nanoparticles scaled up by Noritake will be marketed in collaboration with Mitsubishi Corporation Group -

Successful Development of Polishing Pads for GaN Wafers
- Contributing to Higher Productivity in Semiconductors for High-Speed 5G/6G Communications -

Silver Paste Bonding Material for Automotive Power Semiconductors
- Joint Development with LG Chem, Achieving Long-term Room Temperature Storage -

Noritake Diamond-Nickel Heat Dissipation Substrate Achieved a High Thermal Conductivity of 1200 W/(m･K)

Noritake Design Collection “HOSHIKAGE”
Collaboration with Yabu Pushelberg
Launch at BDNY 2024 -Boutique Design New York

Announcement of the development of porous support “SUPCA" for DAC
- enables efficient CO2 capture and environmentally friendly design with our exclusive technology -