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Thick Film Circuit Substrate
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About Our Thick Film Manufacturing Technology
Gold-plated Printed Substrates
Printed circuit substrates with silver conductor traces can be plated with gold.
This results in excellent soldering and wire bonding characteristics.
Thick film circuits can be formed on ceramic substrates up to 310 mm in length.
Substrate size: 310 mm × 95 mm maximum
Fine Line Printing
Minimum lines and spacing: 50 μm / 50 μm
Circuit substrates can be castellated to support surface mount devices.
Via-filling substrates can handle higher current levels than ordinary through-hole substrates.
They are also effective in raising heat dissipation with thermal vias.