About Our Technology

About Our Thick Film Manufacturing Technology

Gold-plated Printed Substrates

Printed circuit substrates with silver conductor traces can be plated with gold.
This results in excellent soldering and wire bonding characteristics.

Long-length Substrates

Thick film circuits can be formed on ceramic substrates up to 310 mm in length.
Substrate size: 310 mm × 95 mm maximum

Fine Line Printing

Minimum lines and spacing: 50 μm / 50 μm

  • Fine Line Printing
  • Fine Line Printing


Circuit substrates can be castellated to support surface mount devices.


Via-filling Substrates

Via-filling substrates can handle higher current levels than ordinary through-hole substrates.
They are also effective in raising heat dissipation with thermal vias.

Via-filling Substrates

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