PRODUCTS

Product Lineup by Material

Pt Paste

Product Name 
(Series)
Firing 
Temperature
Film Formation 
Method
Application Remarks Lead-Free 
OK
NP-1300 900-1200°C Screen printing Sensors, piezoelectric ceramics, varistors, condensers and other electrodes Good coverage, thin layering possible, good adhesion to ceramic substrates ●
NP-1610 1200-1400°C High heat resistance and reliability ●

Ag/Pd Paste

Product Name 
(Series)
Firing 
Temperature
Film Formation 
Method
Application Ag/Pd Powder Remarks Lead-Free 
OK
NP-3200 850-1050°C Screen printing Piezoelectric ceramics, varistors, LTCC, resonators and other internal electrodes Coprecipitated Low-cost type, thin layering possible, Ag/Pd = 90/10 – 70/30 ●
NP-3000 900-1150°C Alloy Highly heat-resistant type, good coverage, Ag/Pd = 90/10 – 70/30 ●

Ag Paste

Product Name 
(Series)
Firing 
Temperature
Film Formation 
Method
Application Remarks Lead-Free 
OK
NP-4635 450-550°C Screen printing Glass and ceramic substrate electrodes Low firing temperatures, low resistance, good adhesiveness ●
NP-4300 800-850°C Ceramic substrates, chip resistors, external electrodes for LTCC Compatible without coat, good solderability ●
NP-4100 850-900°C Internal electrodes for LTCC and inductors Low resistance, shrinkage curvature control, high-definition patterns ●
NP-4200 Non-shrinkable type, fills well ●
NP-4424 680-720°C Dip Inductors, varistors, chip resistors, external electrodes for LTCC Applies smoothly, good adhesiveness ●
NP-4324 800-850°C Compatible without coat, good solderability ●
NP-4389 800-850°C Decalcomania roll Compatible without coat, optimal for multiple terminals ●
NP-4700 550-600°C Photo process Glass substrate electrodes Useable for high-definition patterns
(L/S=30/30μm)
●

Au Paste

Product Name 
(Series)
Firing 
Temperature
Film Formation 
Method
Application Remarks Lead-Free 
OK
NP-5100 850-900°C Screen printing Electrodes for glass and ceramic substrates as well as chip parts Good adhesiveness, good for elaborate detail ●

Glass Paste

Product Name 
(Series)
Firing 
Temperature
Film Formation 
Method
Application Remarks Lead-Free 
OK
NP-7091 450-550°C Screen printing Glass substrates Low firing temperatures, good acid resistance ●
NP-7770 550-600°C Transparent type, high transmittance ●
NP-7612 800-900°C Special quality: high voltage resistance ●

Au Resinate Paste

Product Name 
(Series)
Firing 
Temperature
Film Formation 
Method
Application Remarks Lead-Free 
OK
D-25 750-850°C Screen printing Electrodes for image sensors thermal printers heads and so on Thin film at 0.2 - 0.6 μm when fired, capable of wire bonding ●

*Lead-Free OK: Shown on paste with no lead oxide or less than 1,000 ppm.
Please note that specification changes and product removal may occur without prior notice.
We can recommend various pastes according to your needs in addition to the product numbers above.

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