Noritake

MENU

PRODUCTS

Diamond Band Saw

Grinding and Polishing Tools

Technical Support

Diamond Band

Diamond saw is used for cutting process such as cropping, blocking and squaring. Two types of product, metal bonded type for polycrystalline silicon and electroplated type for monocrystalline silicon, sapphire are available.

Metal Bond Band Saw

Metal Bonded Diamond Band
Features
1.The new bond (MS Series) and our original grain dispersion technology stabilizes the cutting performance.
2.Less dulling of the metal chip corners prevents inclined cutting.
3.Special stainless steel with high fatigue strength for the substrate enables a long life.
Straightness keeping and long life are achieved

Electroplated Band Saw

Electroplated Diamond Band
Feature
1. Special substrate enables high precision cutting.
2. High efciency and long life can be attained by selecting the electroplating type(pattern, continuous).
Applications

Cutting of silicon, glass, magnetic materials, carbon, etc.

Specifications

Type of grit size Length width

Substarate

thickness

Diamond layer

thickness

Metal bond #60-120 3,660-10,000mm 40-155mm 0.5-1.25mm 1.0-2.5mm
Electroplated #40-200 1,500-9,000mm 10-60mm 0.3-0.7mm 0.6-1.5mm
Applications

Cutting of silicon, sapphire, glass, magnetic materials, carbon, etc.