Beveling Wheel for Wafer

Grinding and Polishing Tools

Technical Support

Beveling Wheel and Notched Wheel for Silicon and Sapphire Wafers

Silicon Wafer Beveling Wheel

Grinding wheel for bevel machining of semiconductor material substrates.
Thanks to a design featuring a uniform layer of fine grains and high-precision finishing technology, this grinding wheel makes high-quality, high-precision machining possible with minimal chipping.Both outer-circumference machining and notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.

Notched Wheel


  • Even and ne diamond layer minimizes processing damage.
  • Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life.
  • Highly precise slotted shape and nishing technology support various wafer shapes.
  • Copper-less supported.

Standard Selection

Applications Sapphire machining Silicon machining
Emphasis on cutting Standard Emphasis on durability
Bond type L-MSF N-MB00 P-MB01 R-MB02

Case Study

  Beveling silicon wafers Beveling sapphire wafers
Outer circumference
Wheel size φ202×20T×19U×30H×3.7X φ202×20T×19U×30H×3.7X
Wheel specifications SD800/1500 P - MB01 SD400 L - MSF
Notch machining Wheel size φ3.8×36L×11T×8U×1.4X φ3.8×36L×11T×8U×1.4X
Wheel specifications SD800/1500 P - MB01 SD400 L - MSF>SD400 L - MSF


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