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New Copper Conductors + Plating Substrate

Specification
Substrate AI2O3
Conductor Cu + Plating
Thermal
Conductivity
25W / (m・K)
Note

sulfur resistance○
Thick film resistance is
poissible

External appearance

<Resistance of Conductor Sulfidation>

Problem: Sulfidation of Ag type systems
Sulfidation occurs on the boundary of the conductor and substrate even when the conductor surface is plated.
In some cases, conductor detachment may occur.

 

新銅導体+メッキ基板_仕様

Solution: Sulfidation resistant Cu conductor + Plating
(Plating also prevents the Cu conductor surface from oxidizing)

New Copper Conductors + Plating Substrate

Item

Specification
Conductor Line & Space 200μm / 200μm
Pad size Min. 0.7mm□
Film thickness Typ. 15μm
Item Specification
Resister
  
Sheet resistance

30~10k Ω/□

Tolerance of resistance Without trimming:+/-30%
With trimming:+/-3~5%
Conductor / Resister overlap Min. 200μm
Item  Specification
 Protector   Tone of color Clear or white
 Film thickness Max. 20μm
 Condutor <=>Protector space Min. 200μm
Item Specification
Plating Film thickness Ni:4~7μm / Pd:0.1~0.3μm / Au:0.03~0.07μm
Item Specification
Printing

Dimentional tolerance

+/-100μm
Position accuracy +200μm / -150μm