Noritake

MENU

PRODUCTS

New Copper Conductors + Plating Substrate

Ceramics & Materials

 

 

Technical Support

Copper conductors are superior to Silver conductor for sulfur resistance.

Addition to this, plating can be applied on the surface of Copper conductor trace to make more robust to sulfurization.

 
Specification
Substrate AI2O3
Conductor Cu + Plating
Thermal
Conductivity
25W / (m・K)
Note

sulfur resistance○
Thick film resistance is
poissible

External appearance
 

<Resistance of Conductor Sulfidation>

Problem: Sulfidation of Ag type systems
Sulfidation occurs on the boundary of the conductor and substrate even when the conductor surface is plated.
In some cases, conductor detachment may occur.

 

 
新銅導体+メッキ基板_仕様

Solution: Sulfidation resistant Cu conductor + Plating
(Plating also prevents the Cu conductor surface from oxidizing)

 
New Copper Conductors + Plating Substrate

Item

Specification
Conductor Line & Space Min. 200μm / 200μm
Pad size Min. 0.7mm□
Film thickness Typ. 15μm
Item Specification
Resister
  
Sheet resistance

30~5k Ω/□

Tolerance of resistance Without trimming:+/-30%
With trimming:+/-3~5%
Conductor / Resister overlap Min. 200μm
Item  Specification
 Protector   Tone of color Clear or white
 Film thickness Max. 20μm
 Condutor <=>Protector space Min. 200μm
Item Specification
Plating Film thickness Ni:4~7μm / Pd:0.1~0.3μm / Au:0.03~0.07μm
Item Specification
Printing

Dimentional tolerance

+/-100μm
Position accuracy +200μm / -150μm
 

Privacy Policy This website uses cookies to deliver better service to customers.
(Please read our Privacy Policy) for information on using our cookies, including how to disable them.