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Copper conductors are superior to Silver conductor for sulfur resistance.
Addition to this, plating can be applied on the surface of Copper conductor trace to make more robust to sulfurization.
| Specification | |
|---|---|
| Substrate | AI2O3 |
| Conductor | Cu + Plating |
| Thermal Conductivity |
25W / (m・K) |
| Note |
sulfur resistance○ |
| External appearance |  |
<Resistance of Conductor Sulfidation>
Problem: Sulfidation of Ag type systems
Sulfidation occurs on the boundary of the conductor and substrate even when the conductor surface is plated.
In some cases, conductor detachment may occur.
Solution: Sulfidation resistant Cu conductor + Plating
(Plating also prevents the Cu conductor surface from oxidizing)
|
Item |
Specification | |
|---|---|---|
| Conductor | Line & Space | Min. 200μm / 200μm |
| Pad size | Min. 0.7mm□ | |
| Film thickness | Typ. 15μm | |
| Item | Specification | |
| Resister |
Sheet resistance |
30～5k Ω/□ |
| Tolerance of resistance | Without trimming：+/-30% With trimming：+/-3～5% |
|
| Conductor / Resister overlap | Min. 200μm | |
| Item | Specification | |
| Protector | Tone of color | Clear or white |
| Film thickness | Max. 20μm | |
| Condutor <=>Protector space | Min. 200μm | |
| Item | Specification | |
| Plating | Film thickness | Ni:4～7μm / Pd:0.1～0.3μm / Au:0.03～0.07μm |
| Item | Specification | |
| Printing |
Dimentional tolerance |
+/-100μm |
| Position accuracy | +200μm / -150μm | |
